? semiconductor components industries, llc, 2012 january, 2012 ? rev. 2 1 publication order number: mbra1h100/d mbra1h100t3g, NRVBA1H100T3G surface mount schottky power rectifier sma power surface mount package employing the schottky barrier principle in a large area metal ? to ? silicon power diode. state of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system. features ? small compact surface mountable package with j ? bent leads ? rectangular package for automated handling ? highly stable oxide passivated junction ? low forward voltage drop ? guardring for stress protection ? aec ? q101 qualified and ppap capable ? nrvba prefix for automotive and other applications requiring unique site and control change requirements ? this is a pb ? free device* mechanical characteristics: ? case: epoxy, molded ? weight: 70 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds ? polarity: cathode lead indicated by polarity band ? esd ratings: ? machine model = c ? human body model = 3b ? device meets msl 1 requirements *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information schottky barrier rectifier 1.0 amperes, 100 volts marking diagrams sma case 403d plastic a110 ayww http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbra1h100t3g sma (pb ? free) 5,000 / tape & reel ** cathode anode a110 = device code a = assembly location y = year ww = work week = pb ? free package 12 NRVBA1H100T3G sma (pb ? free) 5,000 / tape & reel ** ** 12 mm tape, 13? reel
mbra1h100t3g, NRVBA1H100T3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (t l = 167 ? c) i o 1.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 50 a storage and operating junction temperature range (note 1) t stg , t j ? 65 to +175 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 2) jcl 14 ? c/w thermal resistance, junction ? to ? ambient (note 2) r ja 75 ? c/w thermal resistance, junction ? to ? ambient (note 3) r ja 280 ? c/w 2. mounted with 700 mm 2 copper pad size (approximately 1 in 2 ) 1 oz fr4 board. 3. mounted with pad size approximately 6 mm 2 copper, 1 oz fr4 board. electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 4) (i f = 1.0 a, t j = 25 ? c) (i f = 2.0 a, t j = 25 ? c) (i f = 1.0 a, t j = 125 ? c) (i f = 2.0 a, t j = 125 ? c) v f 0.76 0.84 0.61 0.68 v maximum instantaneous reverse current (note 4) (rated dc voltage, t j = 25 ? c) (rated dc voltage, t j = 125 ? c) i r 40 0.5 a ma 4. pulse test: pulse width ? 380 s, duty cycle ? 2.0%.
mbra1h100t3g, NRVBA1H100T3G http://onsemi.com 3 typical characteristics figure 1. typical forward voltage figure 2. maximum forward voltage v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 0.8 0.6 0.4 0 0.2 0.1 1 10 100 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 1 10 100 figure 3. typical reverse current figure 4. maximum reverse current v r , reverse voltage (v) 90 80 60 50 30 20 10 0 0.00001 0.0001 0.001 0.01 0.1 1 10 i f , forward current (a) i f , forward current (a) i r , reverse current (ma) 1.2 1.4 1.0 150 ? c 125 ? c 25 ? c 40 70 100 150 ? c 125 ? c 25 ? c figure 5. current derating t l , lead temperature ( ? c) 165 150 145 140 135 0 0.5 1.0 1.5 2.0 i f(av) , average forward current (a) dc square wave 155 170 160 r jl = 14 ? c/w i o , average forward current (a) 1 0.8 0.6 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1.0 p fo , average power dissipation (w) t j = 175 ? c dc square wave figure 6. forward power dissipation 0.2 0 150 ? c 125 ? c 25 ? c 175 1.6 1.4 1.2 v r , reverse voltage (v) 90 80 60 50 30 20 10 0 i r , reverse current (ma) 40 70 10 0 0.00001 0.0001 0.001 0.01 0.1 1 10 150 ? c 125 ? c 25 ? c
mbra1h100t3g, NRVBA1H100T3G http://onsemi.com 4 typical characteristics figure 7. capacitance v r , reverse voltage (v) 80 70 60 50 30 20 10 0 0 20 40 60 80 120 c, capacitance (pf) 40 90 100 100 140 t j = 25 ? c 0.1 0.00001 pulse time (s) 100 10 0.1 0.01 0.0001 0.001 0.01 1.0 10 100 0.000001 50% (duty cycle) 20% 10% 5.0% 2.0% 1.0% single pulse 1000 r(t) (c/w) 1.0 0.1 0.00001 pulse time (s) 100 10 0.1 0.01 0.0001 0.001 0.01 1.0 10 100 0.000001 50% (duty cycle) 20% 10% 5.0% 2.0% 1.0% single pulse 1000 r(t) (c/w) figure 8. thermal response, junction ? to ? ambient (6 mm 2 pad) 1.0 1000 figure 9. thermal response, junction ? to ? ambient (1 in 2 pad)
mbra1h100t3g, NRVBA1H100T3G http://onsemi.com 5 package dimensions dim a min nom max min millimeters 1.97 2.10 2.20 0.078 inches a1 0.05 0.10 0.15 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.083 0.087 0.004 0.006 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e sma case 403d ? 02 issue f style 1: pin 1. cathode (polarity band) 2. anode e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 403d ? 01 obsolete, new standard is 403d ? 02. polarity indicator optional as needed (see styles) 4.0 0.157 2.0 0.0787 2.0 0.0787 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbra1h100/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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